If you’re designing anything with Power over Ethernet (PoE) or Power over Data Line (PoDL), these systems can be directly ...

A new technical paper titled “Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity” was published by researchers at Arizona State University and University ...

The latest revision of the ESD standard has been released, bringing significant updates, new test parameters, and specific ...

What’s different about electrostatic discharge in stacked-die architectures.

Iron-on patches can repair clothing or add personal flair to backpacks and hats. And now they could power wearable tech, too.

Researchers have combined liquid metal and a heat-activated adhesive to create an electrically conductive patch that bonds to ...

SEPTA has completed federally required inspections on all 223 Silverliner IV Regional Rail cars, meeting an extended deadline set by the Federal Railroad Administration after multiple fires were ...

EMIS has expanded its range of FeedThrough components designed to improve high-frequency noise suppression and boost EMC ...

Kyle has written professionally across the motorsport and motoring world since graduating from Plymouth University in 2018, and has acted as the MotoGP editor for Motorsport Week and as a Features ...

SAN JOSE, Calif., Nov. 24, 2025 /PRNewswire/ -- Power management leader, Kinetic Technologies, is expanding its USB Protection portfolio with the introduction of its KTS1287 and KTS1289 flat-clamp ...

Abstract: This paper presents an approach, circuit under inductor (CUI), to reduce chip area as a solution for design technology co-optimization (DTCO) in sub-10-GHz RF and millimeter-wave (mmWave) ...

Abstract: The increasing demand for wearable and portable IoT devices necessitates alternatives to traditional battery-powered systems, leading to the emergence of RF energy harvesting as a viable ...